This equipment is a bonding machine at high-speed lead frames
for semiconductor chips that have finished sewing of semiconductor wafers .
| General Specification | |
| System Capability | Cycle Time : 180ms |
| X,Y Placement | ±35㎛ under |
| Wafer | 6” Standard (8” Option) |
| Material | Die Size : 0.15×0.15 ~ 5.08~5.08mm |
| Vision | 256 Gray Level ( Resolution : 480×480 Pixel ) |
| Bonding Force | 30~ 300g (Programmable) |
| Dimension | 1,600(L) × 1,300(W) × 1,700(H) |
