PNT’s Precision Automation Division was a business that advanced in 2009 based on its core capabilities in roll-to-roll processing equipment, and succeeded in developing the first 300mm wafer grinder in Korea, and is also spurring the development of 450mm wafer grinder. In addition, our company developed “Solder Die Bonder” which is an equipment for LED assembly process in 2010 and entered the LED business, and in November 2011, “VCM Auto-Line for Camera” was launched.