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CSP LED Taping Machine

CSP LED Taping Machine

Machine Introduction

본 장비는 Wafer상의 LED Chip을 SMT용 Carrier Tape에 고속으로 Taping 하는
장비이다

Machine Specification

Description General specification
INDEX TIME Cycle Time : 180ms
TAPING ACCURACY X.Y=25㎛ under
Chip Size 0.12 x 0.12 ~ 4 x 4mm, 0.1~3.5mm(T)
Taping Force 20-300g (Digital Setting )
Vision ZOOM LENS (0.5X)
Wafer Type BIN Plate & Wafer Ring
Wafer Loading Automatic Cassette & Transfer